As the global economy mends, the 2021 growth of Advanced Semiconductor Packaging will have significant change from previous year. According to our (LP Information) latest study, the global Advanced Semiconductor Packaging market size is USD million in 2022 from USD 15330 million in 2021, with a change of % between 2021 and 2022. The global Advanced Semiconductor Packaging market size will reach USD 25900 million in 2028, growing at a CAGR of 7.8% over the analysis period.
The United States Advanced Semiconductor Packaging market is expected at value of US$ million in 2021 and grow at approximately % CAGR during review period. China constitutes a % market for the global Advanced Semiconductor Packaging market, reaching US$ million by the year 2028. As for the Europe Advanced Semiconductor Packaging landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 5-year period.
Global main Advanced Semiconductor Packaging players cover Amkor, SPIL, Intel Corp, and JCET, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of Advanced Semiconductor Packaging market by product type, application, key manufacturers and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022, in Section 2.3; and forecast to 2028 in section 12.6
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Others
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 12.7.
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the prominent manufacturers in this market, include
Amkor
SPIL
Intel Corp
JCET
ASE
TFME
TSMC
Huatian
Powertech Technology Inc
UTAC
Nepes
Walton Advanced Engineering
Kyocera
Chipbond
Chipmos